Commodity Applicable Q Code List
Note: Review each commodity being supplied in this list, then adhere to the requirements based on each applicable Q code.
| Category | Commodity | Q Code |
| Metal | Aluminum housings, heat sinks, parts (Non-Space)
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Q1, Q2, Q3, Q7, Q12, Q21, Q40
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| Aluminum housings, heat sinks, parts (Space) | Q1, Q2, Q3, Q7, Q12, Q21, (Q36 or Q37 or Q38 for type of Space job, will be identified on Purchase Order), Q40 | |
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Outside Machining |
Q1, Q2, Q3, Q7, Q12, Q40 |
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Sheet Metal Parts |
Q1, Q2, Q3, Q7, Q12, Q40 |
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Aluminum, Steel, Brass |
Q1, Q11, Q21, Q40 |
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Silk Screening |
Q1, Q15, Q40 |
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Anodizing |
Q1, Q15, Q21, Q40 |
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Chem. Film |
Q1, Q15, Q21, Q40 |
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Plating, Gold, Etc. Silver |
Q1, Q15, Q21, Q40 Q1, Q15, Q17, Q21, Q40 |
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| PCB |
Bare Printed Circuit Boards (Non-Space) |
Q1, Q2, Q3, Q6, Q7, Q18, Q20, Q21, Q22, Q25, Q30, Q31, Q35, Q39, Q40 |
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Bare Printed Circuit Boards (Space) |
Q1, Q2, Q3, Q6, Q7, Q19, Q20, Q21, Q22, q24, Q25, Q30, Q31, Q35, Q39 (Q36 or Q37 or Q38 for type of Space Job, will be defined on Purchase Order), Q40
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Flex Printed Circuit Boards (Non Space) |
Q1, Q2, Q3, Q6, Q7, Q18, Q20, Q21, Q22, Q25, Q30, Q31, Q35, Q39, Q40 |
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| Flex Printed Circuit Boards (Space) | Q1, Q2, Q3, Q6, Q7, Q19, Q20, Q21, Q22, Q24, Q25, Q30, Q31, Q35, Q39 (Q36 or Q37 or Q38 for type of Space Job, will be defined on Purchase Order), Q40 | |
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| Contract Manufacturing | Contract Manufacturing (Printed Circuit Board Assembly) | Q1, Q2, Q3, Q6, Q7, Q11, Q12, Q21, Q23, Q25, Q27, Q28, Q29, Q32, Q33, Q34, Q35 (If Space Job, Type Q36 or Q37 or Q38 will be identified on Purchase Order), Q40 |
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| Electronic Parts | Capacitors | Q1, Q16, Q17, Q21, Q40 |
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Connectors |
Q1, Q16, Q17, Q21, Q40 |
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Filters |
Q1, Q16, Q17, Q21, Q40 |
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I.C.s |
Q1, Q16, Q17, Q21, Q40 |
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Inductors |
Q1, Q16, Q17, Q21, Q40 |
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Loads |
Q1, Q16, Q17, Q21, Q40 |
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Regulators |
Q1, Q16, Q17, Q21, Q40 |
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Resistors |
Q1, Q16, Q17, Q21, Q40 |
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Source Control Document Purchases |
Q1, Q13, Q16, Q17, Q21, Q40 |
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Transistors |
Q1, Q16, Q17, Q21, Q40 |
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Switches |
Q1, Q16, Q17, Q21, Q40 |
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Other Electronic Parts |
Q1, Q16, Q17, Q21, Q40 |
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| Cables | RF and DC | Q1, Q2, Q3, Q21, Q26, Q40 |
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| Space Requirements |
Noted requirements and information is required to accompany the received material. Applies to all levels of Space jobs – Q36 Commercial, Q37 Standard & Q38 Critical. |
Q1, Q16, Q17, Q19, Q21, Q23 (Q36 or Q37 or Q38 for type of Space job, will be identified on Purchase Order), Q40 |
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| Miscellaneous Hardware | Screws | Q1, Q16, Q40 |
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Fasteners |
Q1, Q16, Q40 |
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Wire |
Q1, Q16, Q40 |
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Epoxy, Silicon Rubber, Adhesive, Conformal Coating |
Q1, Q6, Q40 |
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Shelf life Materials |
Q1, Q6, Q40 |
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Packaging Materials |
Q1, Q40 |
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Gaskets |
Q1, Q2, Q3, Q40 |
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Other Hardware |
Q1, Q2, Q3, Q40 |
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| Test & Calibration | Test Equipment, New | Q1, Q14 |
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Test Equipment, Used |
Q1, Q14 |
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Calibration |
Q1, Q14 |
Note: If Suppliers have any Quality Issues or Questions (QIQ) regarding these Quality Codes, please email: QIQ@Aethercomm.com
Form#F-143 Rev AE (Last Updated 02/01/2024)
Quality Code Flow Downs for Purchase Orders
| Q Attachment | Requirement | Detailed Requirement | |
| Q1 | General Quality Requirements | General Quality Requirements | |
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The following statement, or equivalent, must be included with each shipment, signed and dated by a company representative. I certify this product meets all purchase order requirements, reference PN(s), quantities, lot #’s, and/or SN’s log and Country Of Origin. |
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| Records | Records of manufacturing, testing, processing, inspection, packaging, and shipping shall be retained for a minimum of 12 years. Records shall be made available for review on request.
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| Counterfeit Parts Mitigation |
The supplier and its’ sub-tier suppliers shall ensure that only new materials are used in products required to be delivered to Aethercomm. Electronic components shall be procured from the OEM/OCMs or their Franchised (licensed) Distributors. No electronic components shall be purchased through or from Non-Franchised Distributors or Brokers without express written approval from Aethercomm Purchasing and Quality Management. The Supplier shall include and flow down this requirement to all sub-tiers for raw materials, electronic parts, or assemblies. | ||
| Competence, Training and Awareness | The supplier shall ensure personnel processing orders or performing work affecting conformity to product or service are trained and aware of the relevance and importance of their activities in relation to meeting the requirements of Aethercomm purchase orders and associated documentation.
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| Product Safety & Ethical Behavior | The supplier shall ensure personnel processing orders or performing work affecting conformity to product or service are aware of their contribution to product safety and the importance of ethical behavior. | ||
| Right of Access | Right of access shall be given to Aethercomm, our customer and regulatory authorities to the applicable areas of all facilities, at any level of the supply chain, involved in the order and to all applicable records.
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| Aethercomm/Customer Requirements Flow Down | Aethercomm will flow down Customer requirements to Suppliers within Notes added to the Purchase Order. Aethercomm Suppliers shall flow down Aethercomm/Customer requirements to their sub-tiers. | ||
| Interactions with Aethercomm | All Supplier Interactions with Aethercomm should be initially coordinated through Purchasing.
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| Provide Test Specimens | When noted on the Purchase Order, Supplier shall provide test specimens for design approval, inspection/verification, investigation, or auditing. | ||
| Inspection & Test System | Inspection & Test System must be in place that ensures contract requirements will be fulfilled.
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| Quality Program | Supplier must have a Quality Program Requirements system in place that ensures contract requirements will be fulfilled | ||
| Non-conformance | A system shall be in effect for the control of material nonconforming to drawings, specifications or other purchase order requirements as per AS9100. If not certified to AS9100, Supplier shall segregate non-conforming material from conforming.
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| Shipping Insurance | Carrier shipping insurance is required for shipment of expensive parts in excess of $3,000. | ||
| Foreign Object Debris (FOD) | Supplier shall establish procedures to control and eliminate Foreign Object Debris and contamination in a manner to lower risk potential throughout the entire process. Procedures or policies developed by Supplier shall be subject to review and audit by Aethercomm or their customers as required.
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| Special Packaging | A specification or instruction will be called out in the Purchase Order for special packaging of material when required. | ||
| No-Clean Solder Paste Flux | The use of no-clean solder paste is prohibited. The use of no-clean flux is acceptable if residue is removed. Should manufacturer’s recommendation state that residue should not be cleaned, then the use of the specific flux is prohibited.
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| Electrostatic Discharge Protection | For the contractual requirements of parts that are ESD sensitive, Supplier shall have an Electrostatic Sensitive Discharge (ESD) control program subject to review and approval by Aethercomm upon request. | ||
| Approved Process Sources | Supplier shall use only Aethercomm approved sub-tier suppliers that can meet the specification of the awarded Purchase Order. A listing of Approved Suppliers will be provided by Aethercomm Purchasing. A certification from the Supplier shall be forwarded with each shipment.
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| GD&T | Unless otherwise specified, dimensioning and tolerancing shall be in accordance with ASME Y14.5 2009. Special attention should be given to section 1.4n which states “Unless otherwise specified, all tolerances apply for the full depth, length and width of the feature”. | ||
| Review Q Codes | Review Quality Codes (at https://www.aethercomm.com/quality-clauses) prior to responding to Aethercomm RFQ (Requests For Quote), during Contract Review after receipt of order and prior to shipment to verify compliance with the latest requirements.
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| Compliance Responsibility | FAI approval does not relieve the Supplier of the responsibility and/or liability for full compliance with all contract requirements. | ||
| Vendor Chargeback | The purpose of Aethercomm’s Vendor Chargeback requirement is to help ensure that Vendors comply with Aethercomm’s quality requirements. Aethercomm holds the Vendor accountable for certain violations and financial penalties will be assessed for non-compliance. Shipments not in conformance with Aethercomm guidelines may be refused and returned at Vendor cost or may be assessed a chargeback. Chargebacks may be issued for damage related to insufficient packaging and Vendor-related quality concerns. Approved chargebacks will be deducted from a future invoice as damages. All questions and concerns regarding chargebacks must be addressed with Aethercomm’s Supplier Quality Engineer. |
| Q2 |
Configuration Control |
If the supplier makes any Class 1 (fit, form, or function) or Class 2 (other than clerical) changes they must notify the Aethercomm Quality Management in writing before the change is implemented. All Class 1 changes require Aethercomm Quality Management approval. This includes any and all process changes required to build the component being purchased. |
| Q3 | First Article Required | As requested on the Purchase Order, suppliers shall submit a First Article Inspection Report (FAIR) that records all inspection measurements, notes, material(s), process(es) on SAE AS9102 form. The FAIR shall reference the Purchase Order number and must accompany the FAIR item(s). Item(s) undergoing FAI shall be identified as FAIR item prior to shipment. All items/assemblies shall have been manufactured using the same production processes and equipment which will be used in fulfilling the contract. The criteria to perform a FAIR is: The documentation shall include: Contract Manufacturing for assembly of PCBA/CCA |
| Q4 | Source Inspection | When listed on the PO, Source Inspection must take place before shipment of product to Aethercomm, typically for FAI. Or as imposed on Supplier by Aethercomm Quality Management, which will provide notification when required.
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| Q5 | Deleted | Not used at this time. |
| Q6 | Shelf Life | Product must be clearly identified with applicable manufacture & expiration dates. All material must have at least 75% of the storage life remaining upon receipt.
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| Q7 | Use-As-Is & Repair | Use-As-Is and Repair are not allowed unless Aethercomm approval is obtained in advance by a signed waiver. |
| Q8 | ISO 9001 | Current Certification by an accredited 3rd party required when listed on the Purchase Order.
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| Q9 | AS9100 | Current Certification by an accredited 3rd party required when listed on the Purchase Order |
| Q10 | Nadcap | Nadcap accreditation -When required Special Process accreditation type will be listed on the Purchase Order.
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| Q11 | Raw Material-Physical and Chemical Analysis | Include raw material certifications with shipment that includes a copy of the detailed report of the physical and chemical analysis Contract Manufacturing: Raw material certifications for fabricated parts (i.e. metal parts) shall be kept on file and available for review when requested |
| Q12 | Clean, oil free | Products shall be clean and free from any residue including but not limited to oil, flux, contamination, and any type of foreign object debris.
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| Q13 | Acceptance Test Report | Include with each shipment a true copy, signed by a responsible representative of the supplier of the result of the lot or item acceptance tests required by the applicable specification. The report shall indicate the actual values obtained. |
| Q14 | Calibration Method | Calibration must meet a minimum of ANSI/NCSL Z 540 and AS9100. This includes: • A certificate of calibration shall be delivered to Aethercomm showing the components outlined in ANSI/NCSL Z540 (most current revision) Certificates and Reports with traceability to reference standards. • In the event of an Out-Of-Tolerance condition, the calibration supplier shall notify Aethercomm promptly • The supplier shall maintain calibration records for a minimum of 12 years • Should repairs be done on a piece of calibrated equipment, the specific repair shall be described by the calibration supplier. See purchase order for any additional information |
| Q15 | Secondary Processes | Include the Aethercomm P.O. number on all documents relating to secondary processes (plating, machining, etc.). Subcontract Assembly and Manufacturing companies – certifications for secondary processes shall be maintained on file for 12 years and available upon request. |
| Q16 | Packaging Bag & Tag – Bulk | When material is not sensitive to shipping or handling damage, the entire lot must be bagged/boxed, and the bag/box must be identified. Parts must not be co-mingled with different part numbers or different lot numbers |
| Q17 | Packaging Bag & Tag-Individual | When material is sensitive to shipping or handling damage the entire lot must be bagged/boxed, and the bag/box must be identified. Parts must not be co-mingled with different part numbers or different lot numbers. Parts must be individually wrapped/segregated to prevent contact with each other. All Silver-plated parts shall be packaged with anti-tarnish material such as but not limited to ‘Silver Saver Paper’. |
| Q18 | IPC-6012 & IPC-A-600 (Latest Revisions) |
Suppliers shall adhere to the latest revisions of IPC-6012 & IPC-A-600.
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| Q19 | IPC-6012 Space & IPC-A-600 (Latest Revisions) |
Suppliers shall adhere to the latest revisions of IPC-6012 Space & IPC-A-600S.
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| Q20 | Electrodeposited Copper Test Frequency: Monthly | When copper plating is specified, electrodeposited copper plating shall meet the following criteria: |
| Q21 | Prohibited Material | The following materials shall not be contained in any deliverable product except where specified on drawing or material specification: • Pure, unalloyed cadmium or alloys containing 5 percent by weight or greater cadmium not completely over-plated by a Buyer approved material. • Pure, unalloyed zinc or alloys containing 20 percent by weight or greater zinc not completely over-plated by a Buyer approved material. • Compound (e.g., plating, paint, other surface finishes) containing greater than 1 percent by weight of cadmium or zinc. Only applies to EEE components; excludes connectors, contacts, wire, lugs, and other mechanical or structural components. • Corrosive solder fluxes, unless detailed cleaning procedures are specified, along with appropriate verification methods to insure removal of residual contaminant. • Pure tin, or >97 percent tin by weight, internally or externally. Tin-Lead finishes and connections shall be alloyed with a minimum of 3 percent lead (Pb) by weight. Note that Sn96/Ag4, Au80Sn20, and Sn95/Sb5 are standard solder-attach materials used in high temperature soldering applications and are acceptable for those applications only. • Magnesium or selenium shall not be used unless inside a hermetically sealed device. • Mercury, alloys of mercury, or compounds of mercury. • Materials exhibiting or known to exhibit natural radioactivity such as uranium, potassium, radium, thorium, and/or any alloys thereof. • Materials exhibiting or known to exhibit health hazards such as unalloyed beryllium, toluene, lithium, and/or any alloys thereof. • Gold plating over silver without a nickel barrier coating, silver under plate on gold contacts and silver-plated terminals and contacts, except movable contacts.
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| Q22 | PCB Metal Finishing Application | External plating shall be such that it shall not promote the growth of whiskers or dendrites and shall not sublime in the intended application conditions and shall adhere to the print driven finish conforming to:
IPC-4552 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards. This requirement is applicable when driven by print note for a metal finish and is called out by design. Follow the thickness requirements detailed in the applicable IPC specification and only utilize the print for type of finish. All products shall be compliant to the IPC specification and have a standard certification of conformance as a deliverable, as well as a XRF report to support the compliance. |
| Q23 | Workmanship | Suppliers shall adhere to the latest J-STD-001, J-STD-001S Space addendum, IPC-A-610, IPC/WHMA-A-620 and IPC/WHMA-A-620S Space addendum as applicable.
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| Q24 | Deleted |
Not used at this time. |
| Q25 | PCB Testing Labs | When IPC testing is required as detailed in these Aethercomm Quality Codes, Suppliers can perform these tests internally if they have existing facilities and qualified personnel. If Supplier has no internal testing capability for IPC requirements, they shall utilize testing labs identified in http://www.ipc.org/4.0_Knowledge/4.1_Standards/test/testing_labs.htm or approved by Aethercomm Quality Management. If a Supplier doesn’t have a lab preference, Aethercomm recommends using Preferred Testing Labs. Information can be found at http://preferredlabs.com/index.html. Suppliers should absorb the cost for required IPC testing, Aethercomm will not pay additional lab fees. |
| Q26 | Cables – Inspection/ Test Data | Seller shall perform and document 100% continuity check for all DC cables. Documentation shall indicate acceptance by seller’s stamp (or signature) and date performed.
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| Q27 | Ground Pad Solder Voids | There is to be no more than 20% solder voiding under any ground pad. X-Ray evidence FA (First Article), MA (Middle Article) and LA (Last Article) that assures compliance to the specification shall be retained for 12 years and made available to Aethercomm upon request. Note: If during assembly Contract Manufacturers have difficulty meeting the above requirement, pre-forms may be utilized at Supplier’s discretion to achieve the requirement. |
| Q28 | Serialization | CCA/PCBA Manufacturers Machined/Fabricated Metal Parts |
| Q29 | Excess Solder | Excess solder/solder projections/solder splash present on the bottom side of the PCBA shall be wicked flat as to not impede the assembly and/or function of the product.
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| Q30 | PCB Packaging |
PCB Fabricators may utilize bulk/brick packaging methods with no more than stacks of 10 slip sheeted PCBs, with Desiccant Packets included. Or individually bagged in bundles of 5 or 10, depending on size and configuration of PCB, with Desiccant Packets included. |
| Q31 | PCB Cleanliness & Ionic Contamination Report | Printed boards shall be tested in accordance with IPC-TM-650 Method 2.3.25 or equivalent methods with equal or better sensitivity and employ solvents with the ability to dissolve flux residue and other contaminants. An Ionic Contamination Cleanliness Report shall accompany shipment paperwork and shall be retained for 12 years. Test results must be under IPC fail point of 10.06 ug NaCl/sq”.
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| Q32 | Surface Mount Electronic Component Placement | Surface mount electronic components including but not limited to SMD resistors and SMD capacitors shall be installed flat per J-STD-001 Class 3 requirements, unless otherwise called out on drawing. |
| Q33 | CCA Requirements | CCA Sub Contractor shall: |
| Q34 | FBGA (Fine -Pitch Ball Grid Array) | FA (First Article), MA (Middle Article) and LA (Last Article) shall be utilized for methodology validation. X-Ray evidence that assures compliance to the specification shall be retained for 12 years and made available to Aethercomm upon request.
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| Q35 | PCB Requirements |
PCB Sub Contractor shall: |
| Q36 | Space Requirements Commercial | • C of C (Certificate of Conformance) on Completed unit. • Assemblers and Inspector shall have valid IPC Space certification to IPC J-STD-001S and IPC/WHMA-620S • Any additional Contract specific requirements will be specified in Purchase Order Notes. |
| Q37 | Space Requirements Standard | • C of C (Certificate of Conformance) on Completed unit. • C of C (Certificate of Conformance) for each part installed. • C of C (Certificate of Conformance) from all Aethercomm Supplier builds and/or testing. • Assemblers and Inspector shall have valid IPC Space certification to IPC J-STD-001S and IPC/WHMA-620S • Any additional Contract specific requirements will be specified in Purchase Order Notes.
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| Q38 | Space Requirements Critical |
• C of C (Certificate of Conformance) on Completed unit. |
| Q39 | PCB Design Selection Characteristics |
During design phase for PCB materials and their characteristics, Aethercomm utilizes careful selection methodology. No Supplier modifications of print selected materials along with their selected dissipation constant (Dk) and dissipation factor (DF) attributes are allowed. Aethercomm products are designed for RF applications and any alterations are disastrous. If supply chain wishes to build material, it must be done in a manner to mimic the OEM attributes. |
| Q40 | General Lot Traceability |
The Supplier or their sub tiers shall provide documentation that maintains OEM (Original Equipment Manufacturer) traceability for materials/components used in the manufacture of Aethercomm part numbers. At minimum, documentation shall include OEM name, part number, CoC (Certificate of Conformance), and COO (Country of Origin). With the exception of COTS: Commodities/Parts generally purchased out of a Catalog/Website such as Grainger, McMaster Carr, supplies from Home Depot, Non-Military/Space EEE or Non-Military/Space fasteners, Hardware shall only be traceable to the rewarded Purchase Order by Aethercomm. |
| Q41 | Batch Lot Traceability |
The Supplier or their sub tiers are required to trace the lot/date code or serial number for each traceable part used on the assembly to the assembly batch lot (work order/job number). |
| Q42 | Single Piece Flow Lot Traceability |
The Supplier or their sub tiers are required to trace the lot/date code or serial number for each traceable part used on the assembly to the individual assembly serial number level. |
Note: If Suppliers have any Quality Issues or Questions (QIQ) regarding these Quality Codes, please email: QIQ@Aethercomm.com
Form#F-099 Rev AT (Last Updated: 11/21/2024)
