Quality Clauses

Commodity Applicable Q Code List

Note: Review each commodity being supplied, then adhere to the requirements based on each applicable Q code.

 

Category Commodity Q Code
Metal Aluminum housings, heat sinks, parts (Non-Space) Q1, Q2, Q3, Q7, Q12
 
Aluminum housings, heat sinks, parts (Space)

Q1, Q2, Q3, Q7, Q12, Q21
 
Outside Machining 

Q1, Q2, Q3, Q7, Q12
 
Sheet Metal Parts 

Q1, Q2, Q3, Q7, Q12
 
Aluminum, Steel, Brass

Q1, Q11
 
Silk Screening 

Q1, Q15
 
Anodizing

Q1, Q15
 
Chem. Film 

Q1, Q15
 

Plating, Gold, Etc. 


Silver


Q1, Q15


Q1, Q15, Q17




PCB Bare Printed Circuit Boards (Non-Space) Q1, Q2, Q3, Q6, Q7, Q12, Q18, Q20, Q25
 
Bare Printed Circuit Boards (Space)

Q1, Q2, Q3, Q6, Q7, Q12, Q19, Q20, Q22, Q24, Q25
 
Flex Printed Circuit Boards (Non-Space)

Q1, Q2, Q3, Q6, Q7, Q12, Q18, Q20, Q25
 
Flex Printed Circuit Boards (Space)

Q1, Q2, Q3, Q6, Q7, Q12, Q19, Q20, Q22, Q24, Q25



CM Contract Manufacturing Q1, Q2, Q3, Q6, Q7, Q11, Q12, Q23, Q25, Q27, Q28, Q29



Electronic Parts Capacitors   Q1, Q16, Q17
 
Connectors 

Q1, Q16, Q17
 
Filters 

Q1, Q16, Q17
 
I.C.s

Q1, Q16, Q17
 
Inductors

Q1, Q16, Q17
 
Loads

Q1, Q16, Q17
 
Regulators 

Q1, Q16, Q17
 
Resistors

Q1, Q16, Q17
 
Source Control Document Purchases

Q1, Q13, Q16, Q17
 
Transistors 

Q1, Q16, Q17
 
Switches 

Q1, Q16, Q17



Cables RF and DC Q1, Q2, Q3, Q26



Space Requirements

Noted requirements and information is required to accompany the received material

Q1, Q16, Q17, Q19, Q21, Q24



Misc HW Screws  Q1, Q16
 
Fasteners 

Q1, Q16
 
Wire 

Q1, Q16
 
Epoxy,  Silicon Rubber,  Adhesive,  Conformal Coating 

Q1, Q6
 
Shelf life Materials 

Q1, Q6
 
Packaging Materials 

Q1
 
Gaskets

Q1, Q2, Q3



Test & Cal Test Equipment, New  Q1, Q14
 
Test Equipment, Used 

Q1, Q14
 

Calibration

 


Q1, Q14

 

Note: If Suppliers have any Quality Issues or Questions (QIQ) regarding these Quality Codes, please email: QIQ@Aethercomm.com

Form#F-143 Rev V

Quality Code Flow Downs for Purchase Orders

Q Attachment Requirement Detailed Requirement
Q1 General Quality Requirements FOR USE ON ALL PURCHASE ORDERS      Q1 applies to all procurements
  Standard Certification  of Conformance (C of C) This statement must be included with shipment, signed and dated by a company representative. I certify this product meets all purchase order requirements, reference PN(s), quantities, lot #’s, and/or SN’s log.

  Records  Records of manufacturing, testing, processing, inspection, packaging, and shipping shall be retained for a minimum of 10 years. Records shall be made available for review on request.

 

Counterfeit Parts
Mitigation

 

The supplier and its’ sub-tier suppliers shall ensure that only new materials are used in products required to be delivered to Aethercomm. Electronic components shall be procured from the OEM/OCMs or their Franchised (licensed) Distributors.  No electronic components shall be purchased through or from Non-Franchised Distributors or Brokers without express written approval from Aethercomm Purchasing and Quality Management. The Supplier shall include and flow down this requirement to all sub-tiers for raw materials, electronic parts, or assemblies.

 

Competence, Training and Awareness

 

The supplier shall ensure personnel processing orders or performing work affecting conformity to product or service are trained and aware of the relevance and importance of their activities in relation to meeting the requirements of Aethercomm purchase orders and associated documentation.

 

Product Safety & Ethical Behavior

 

The supplier shall ensure personnel processing orders or performing work affecting conformity to product or service are aware of their contribution to product safety and the importance of ethical behavior.

 

Right of Access

 

Right of access shall be given to Aethercomm, our customer and regulatory authorities to the applicable areas of all facilities, at any level of the supply chain, involved in the order and to all applicable records.

 

Customer Requirements  Flow Down

 

Customer requirements will be flowed down (as required) to External Providers, typically within Notes added to the Purchase Order.

 

Interactions with Aethercomm

 

All Supplier Interactions with Aethercomm should be initially coordinated through Purchasing.

 

Provide Test Specimens

 

When noted on the Purchase Order, Supplier shall provide test specimens for design approval, inspection/verification, investigation, or auditing.

 

Inspection & Test System

 

Inspection & Test System must be in place that ensures contract requirements will be fulfilled.

 

Quality Program

 

Supplier must have a Quality Program Requirements system in place that ensures contract requirements will be fulfilled.

  Non-conformance A system shall be in effect for the control of material nonconforming to drawings, specifications or other purchase order requirements as per AS9100. If not certified to AS9100, Supplier shall segregate non-conforming material from conforming.

  Shipping Insurance Carrier shipping insurance is required for shipment of expensive parts in excess of $3,000.
 

Foreign Object Debris (FOD)

 


Supplier shall establish procedures to control and eliminate Foreign Object Debris and contamination in a manner to lower risk potential throughout the entire process. Procedures or policies developed by Supplier shall be subject to review and audit by Aethercomm or their customers as required.

 

Special Packaging

 

A specification or instruction will be called out in the Purchase Order for special packaging of material when required.

 

No-Clean Solder Paste Prohibited

 

The use of no-clean solder paste is prohibited.

 

Electrostatic Discharge Protection

 

For the contractual requirements of parts that are ESD sensitive, Supplier shall have an Electrostatic Sensitive Discharge (ESD) control program subject to review and approval by Aethercomm upon request.

 

GD&T

 

Unless otherwise specified, dimensioning and tolerancing shall be in accordance with ASME Y14.5 2009. Special attention should be given to section 1.4n which states “Unless otherwise specified, all tolerances apply for the full depth, length and width of the feature.”

 

Review Q Codes prior to shipment

 

Review Quality Codes (at https://www.aethercomm.com/quality-clauses) prior to shipment to verify compliance with the latest requirements.

Q2

Configuration Control

 

If the supplier makes any Class 1 (fit, form, or function) or Class 2 (other than clerical) changes they must notify the Aethercomm Quality Management in writing before the change is implemented.  All Class 1 changes require Aethercomm Quality Management approval. This includes any and all process changes required to build the component being purchased.

Q3 First Article Required   Suppliers of bare printed circuit boards and fabricators of housings shall submit a First Article Inspection Report (FAIR) that records all inspection measurements and notes on SAE AS9102 form or in Seller’s format (if equivalent to AS9102 contents). The FAIR shall reference the Purchase Order number and must accompany the FAIR item.  Item undergoing FAIR shall be identified as FAIR item prior to shipment. All items/assemblies shall have been manufactured using the same production processes and equipment which will be used in fulfilling the contract.
The criteria to perform a FAIR is:
    • Initial fabrication of parts
    • Parts have not been fabricated in two years
    • Engineering drawing has been revised since parts were last fabricated (only delta FAIR is required)
 The documentation shall include:
    • Drawing and Actual dimensions of the FAIR used to verify the part is compliant to the drawing (unless specifically stated on the PO)
    • Mill report/certifications for raw material, as required
    • Special Process certifications from sub tier suppliers
    • Heat Treat certifications, as required
Suppliers of housings, heat sinks or other fabricated metal parts and gaskets shall submit a First Article Inspection Report consisting of the Supplier’s standard final inspection report and a ballooned Aethercomm drawing.

Suppliers of Cables shall submit a First Article Inspection Report consisting of the Supplier’s standard final inspection report and a ballooned Aethercomm drawing.

Contract Manufacturing for assembly of PCBs
    • The criteria to perform a FAIR is the same as detailed above. AS9102 required only for PCBs, not PCBAs
    • CM’s awarded turn-key orders are required to flow down FAIR requirements to sub-tier suppliers.


Q4 Source Inspection When listed on the PO, Source Inspection must take place before shipment of product to Aethercomm, typically for FAI. Or as imposed on Supplier by Aethercomm Quality Management, which will provide notification when required.
Q5 Approved Process Sources
Supplier shall use only those qualified processing sources that can meet the specification of the awarded Purchase Order. A certification from the Supplier shall be forwarded with each shipment.

Q6 Shelf Life Product must be clearly identified with applicable manufacture & expiration dates. All material must have at least 75% of the storage life remaining upon receipt.
Q7 Use-As-Is & Repair
Use-As-Is and Repair are not allowed unless Aethercomm approval is obtained in advance by a signed waiver.

Q8 ISO 9001 Current Certification by an accredited 3rd party required when listed on the Purchase Order.

Q9 AS9100 Current Certification by an accredited 3rd party required when listed on the Purchase Order.
Q10 Nadcap
Nadcap accreditation -When required Special Process accreditation type will be listed on the Purchase Order.

Q11 Raw Material-Physical and Chemical Analysis  Include raw material certifications with shipment that includes a copy of the detailed report of the physical and chemical analysis                    Contract Manufacturing:
Raw material certifications for fabricated parts (i.e. metal parts) shall be kept on file and available for review when requested.
Q12 Clean, oil free
All screws, nuts, washers, standoffs, fabricated housings and other machine parts must be clean & free of oil residue.

Q13 Acceptance Test Report Include with each shipment a true copy, signed by a responsible representative of the supplier of the result of the lot or item acceptance tests required by the applicable specification. The report shall indicate the actual values obtained.

Q14 Calibration Method Calibration must meet a minimum of ANSI/NCSL Z 540-1 and AS9100.
This includes:
• A certificate of calibration shall be delivered to Aethercomm showing the components outlined in ANSI/NCSL Z540.1 Certificates and Reports with traceability to reference standards.
• In the event of an Out-Of-Tolerance condition, the calibration supplier shall notify Aethercomm promptly
• The supplier shall maintain calibration records for a minimum of 10 years
• Should repairs be done on a piece of calibrated equipment, the specific repair shall be described by the calibration supplier.
See purchase order for any additional information.
Q15 Secondary Processes
Include the Aethercomm P.O. number on all documents relating to secondary processes (plating, machining, etc.).
Subcontract Assembly and Manufacturing companies – certifications for secondary processes shall be maintained on file for 10 years and available upon request.

Q16 Packaging Bag & Tag –  Bulk When material is not sensitive to shipping or handling damage, the entire lot must be bagged/boxed, and the bag/box must be identified. Parts must not be co-mingled with different part numbers or different lot numbers.
Q17 Packaging Bag & Tag-Individual 
When material is sensitive to shipping or handling damage the entire lot must be bagged/boxed, and the bag/box must be identified. Parts must not be co-mingled with different part numbers or different lot numbers Parts must be individually wrapped/segregated to prevent contact with each other.
All Silver-plated parts shall be packaged with anti-tarnish material such as but limited to ‘Silver Saver Paper’.
Q18 IPC-6012 & IPC-A 600 (Latest Revisions)
Qualification and Performance Specification for Rigid Printed Boards & Acceptability of Printed Boards Class of PCB = Class 3

Q19 IPC-6012 Space & IPC-A-600 (Latest Revisions) Space and Military Avionics Applications Addendum to IPC-6012 & Acceptability of Printed Boards Class of PCB = Class 3
Q20 Electrodeposited Copper Test Frequency: Monthly

When copper plating is specified, electrodeposited copper plating shall meet the following criteria:  a) When tested as specified in IPC-TM-650, Method 2.3.15, the purity of copper shall be no less than 99.50% b) When tested as specified in IPC-TM-650, Method 2.4.18.1, using 50-100um [1,969-3,937 uin] thick samples, the tensile strength shall be no less than 275.8 MPa [40,000 PSI] and elongation shall be no less than 18%.


Q21 Space Prohibited Material The following materials shall not be contained in any deliverable product except where specified on drawing or material specification:
• Pure, unalloyed cadmium or alloys containing 5 percent by weight or greater cadmium not completely over-plated by a Buyer approved material.
• Pure, unalloyed zinc or alloys containing 20 percent by weight or greater zinc not completely over-plated by a Buyer approved material.
• Compound (e.g., plating, paint, other surface finishes) containing greater than 1 percent by weight of cadmium or zinc. Only applies to EEE components; excludes connectors, contacts, wire, lugs, and other mechanical or structural components.
• Corrosive solder fluxes, unless detailed cleaning procedures are specified, along with appropriate verification methods to insure removal of residual contaminant.
• Pure tin, or >97 percent tin by weight, internally or externally. Tin-Lead finishes and connections shall be alloyed with a minimum of 3 percent lead (Pb) by weight. Note that Sn96/Ag4, Au80Sn20, and Sn95/Sb5 are standard solder-attach materials used in high temperature soldering applications and are acceptable for those applications only.
• Magnesium or selenium shall not be used unless inside a hermetically sealed device.
• Mercury, alloys of mercury, or compounds of mercury.
• Materials exhibiting or known to exhibit natural radioactivity such as uranium, potassium, radium, thorium, and/or any alloys thereof.
• Materials exhibiting or known to exhibit health hazards such as unalloyed beryllium, toluene, lithium, and/or any alloys thereof.
• Gold plating over silver without a nickel barrier coating, silver under plate on gold contacts and silver-plated terminals and contacts, except movable contacts.

Q22 Space Prohibited Material External plating shall be such that it shall not promote the growth of whiskers or dendrites and shall not sublime in the intended application conditions.
Q23 Workmanship
Workmanship Classification for J-STD-001, IPC-A-610 and IPC/WHMA-A-620 shall be Class 3

Q24 Space Requirements For the below listed material types, the noted requirements and information is required to accompany the received material:                            Date Code or Lot Code shall be stated on the C of C and shall match the part label.

Electronic Components – Lot Code or Date Code and C of C (Certification of Conformance)
    Serial Number (if applicable)
Wires – Lot Code or Date Code and C of C
Hardware – Lot Code or Date Code and C of C.
    Special Process C of C if Loctite has been used on Hardware.
Epoxies – Lot Code or Date Code, C of C, Date of Manufacture and Expiration Date

Custom Parts*:
Metal – Lot Code or Date Code and C of C for Raw Material                                                                                                                                                      Printed Circuit Boards – Lot Code or Date Code, serialization and C of C
Following shall be delivered from each lot manufactured.                                                                                                                                                                                                                                                      Reports: Copies of your internal data-report for;
    Lab Cross Section report
    Electrical Test CofC
    Impedance Test Report (when applicable)                                                                                                                                                                                            Coupons: Set of A & B coupons.
Solder Sample
Cross Section Solder Floated Mount:
Ceramic (Substrates) Printed Circuit Board– Lot Code or Date Code, serialization and C of C
       Reports: Copies of your internal Lab Cross Section or XRF results, Electrical Test or statement
        no Opens/Shorts
        A solder sample shall be delivered from each lot manufactured.
Cables – Lot Code or Date Code and C of C
SCD (Source Control Drawing) – Lot Code or  Date Code and C of C
Subcontract assembly manufacturing – Lot Code or Date Code and C of C for Raw Material.                                                                                              Raw Material – Purchased items that are used to build the final unit.
Screened Parts for Space shall be marked with a colored dot that is baked on the part to identify that the part has been screened.

*Notes: Include C of C for Special Process if applicable. Supplier to retain C of C for raw material for 10 years and make available to Aethercomm if requested.


Q25 PCB Testing Labs When IPC testing is required as detailed in these Aethercomm Quality Codes, Suppliers can perform these tests internally if they have existing facilities and qualified personnel. If Supplier has no internal testing capability for IPC requirements, they shall utilize testing labs identified in http://www.ipc.org/4.0_Knowledge/4.1_Standards/test/testing_labs.htm or approved by Aethercomm Quality Management. If a Supplier doesn’t have a lab preference, Aethercomm recommends using Preferred Testing Labs. Information can be found at http://preferredlabs.com/index.html. Suppliers should absorb the cost for required IPC testing, Aethercomm will not pay additional lab fees.

Q26 Cables –                  Inspection/Test Data Where testing is not specified by the drawing, test data confirming that 100% VSWR and Insertion Loss Testing was successfully performed for all RF cables and 100% Continuity check was successfully performed for all DC cables, shall be recorded and retained by Seller for each shipment and shall indicate acceptance by seller’s stamp (or signature) and date performed.

Q27 Ground Pad Solder Voids There is to be no more than 20% solder voiding under any ground pad
Note: If during assembly Contract Manufacturers have difficulty meeting the above requirement, pre-forms may be utilized at Supplier’s discretion to achieve the requirement.

Q28 Serialization Products shall be serialized and barcoded on an ESD-Safe label in a manner in which the printed serial number shall be legible and visually readable. Unless otherwise stated on the drawing, format of the barcode and serial number shall be at the supplier’s discretion.

Contract Manufacturers – Unless stated on the drawing, barcode labels shall be applied on the top side of the PCBA in such a way that does not interfere with the assembly of the product.


Q29 Excess Solder Excess solder present on the bottom side of the PCBA shall be wicked flat as to not impede the assembly and/or function of the product. Suppliers may utilize ‘Kapton Tape’ on PCBs with exposed vias to mitigate issues that arise from solder migration.

Note: If Suppliers have any Quality Issues or Questions (QIQ) regarding these Quality Codes, please email: QIQ@Aethercomm.com

Form#F-099 Rev AC

Contact Us

Contact Us form